Semiconductor Underfill - Global Top Players Market Share and Ranking 2025- YH Research

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Semiconductor Underfill - Global Top Players Market Share and Ranking 2025

Publication Date: 2025-09-12
Report Id: 2375327
Industry: Chemical & Material
Report Page: 117
Chart: 112

PDF Download

Publication Date: 2025-09-12
Report Id: 2375327
Industry: Chemical & Material
Report Page: 117
Chart: 112

PDF Download

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Table of Contents
Description
Table of Figures
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1 Market Overview
1.1 Semiconductor Underfill Definition
1.2 Global Semiconductor Underfill Market Size and Forecast
1.2.1 By Consumption Value, Global Semiconductor Underfill Market Size, 2020-2031
1.2.2 By Sales Quantity, Global Semiconductor Underfill Market Size, 2020-2031
1.2.3 Global Semiconductor Underfill Average Selling Price (ASP), 2020-2031
1.3 China Semiconductor Underfill Market Size and Forecast
1.3.1 By Consumption Value, China Semiconductor Underfill Market Size, 2020-2031
1.3.2 By Sales Quantity, China Semiconductor Underfill Market Size, 2020-2031
1.3.3 China Semiconductor Underfill Average Selling Price (ASP), 2020-2031
1.4 Share of China Semiconductor Underfill Market with Respect to the Global Market
1.4.1 By Consumption Value, China Semiconductor Underfill Market Share in Global, 2020-2031
1.4.2 By Sales Quantity, China Semiconductor Underfill Market Share in Global, 2020-2031
1.4.3 Semiconductor Underfill Market Size: China VS Global, 2020-2031
1.5 Semiconductor Underfill Market Dynamics
1.5.1 Semiconductor Underfill Market Drivers
1.5.2 Semiconductor Underfill Market Restraints
1.5.3 Semiconductor Underfill Industry Trends
1.5.4 Semiconductor Underfill Industry Policy

2 Global Leading Manufacturers and Market Share
2.1 By Revenue of Semiconductor Underfill, Global Market Share by Company, 2020-2025
2.2 By Sales Quantity of Semiconductor Underfill, Global Market Share by Company, 2020-2025
2.3 Semiconductor Underfill Average Selling Price (ASP) by Company, 2020-2025
2.4 Global Semiconductor Underfill Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.5 Global Semiconductor Underfill Concentration Ratio
2.6 Global Semiconductor Underfill Mergers & Acquisitions, Expansion Plans
2.7 Global Semiconductor Underfill Manufacturers Product Type
2.8 Head Office and Semiconductor Underfill Production Site of Key Manufacturer
2.9 Semiconductor Underfill Capacity of Major Manufacturers and Future Plan

3 China Leading Manufacturers and Market Share
3.1 By Revenue of Semiconductor Underfill, China Market Share by Company, 2020-2025
3.2 By Sales Quantity of Semiconductor Underfill, China Market Share by Company, 2020-2025
3.3 China Semiconductor Underfill Semiconductor Underfill Participants, Market Position (Tier 1, Tier 2, and Tier 3)

4 Global Producing Regions
4.1 Global Semiconductor Underfill Capacity, Output and Capacity Utilization, 2020-2031
4.2 Global Semiconductor Underfill Capacity by Region
4.3 Global Semiconductor Underfill Production & Forecast by Region, 2020 VS 2024 VS 2031
4.4 Global Semiconductor Underfill Production by Region, 2020-2031
4.5 Global Semiconductor Underfill Production Market Share & Forecast by Region, 2020-2031

5 Industry Chain Analysis
5.1 Semiconductor Underfill Industry Chain
5.2 Semiconductor Underfill Upstream Analysis
5.2.1 Semiconductor Underfill Core Raw Materials
5.2.2 Main Manufacturers of Semiconductor Underfill Core Raw Materials
5.3 Midstream Analysis
5.4 Downstream Analysis
5.5 Semiconductor Underfill Production Mode
5.6 Semiconductor Underfill Procurement Model
5.7 Semiconductor Underfill Industry Sales Model and Sales Channels
5.7.1 Semiconductor Underfill Sales Model
5.7.2 Semiconductor Underfill Typical Distributors

6 Sights by Type
6.1 Semiconductor Underfill Classification by Type
6.1.1 CUF
6.1.2 NCP/NCF
6.2 by Type, Global Semiconductor Underfill Consumption Value & CAGR, 2020 VS 2024 VS 2031
6.3 by Type, Global Semiconductor Underfill Consumption Value, 2020-2031
6.4 by Type, Global Semiconductor Underfill Sales Quantity, 2020-2031
6.5 by Type, Global Semiconductor Underfill Average Selling Price (ASP), 2020-2031

7 Sights by Application
7.1 Semiconductor Underfill Segment by Application
7.1.1 Automotive
7.1.2 Telecommunication
7.1.3 Consumer Electronics
7.1.4 Other
7.2 by Application, Global Semiconductor Underfill Consumption Value & CAGR, 2020 VS 2024 VS 2031
7.3 by Application, Global Semiconductor Underfill Consumption Value, 2020-2031
7.4 by Application, Global Semiconductor Underfill Sales Quantity, 2020-2031
7.5 by Application, Global Semiconductor Underfill Price, 2020-2031

8 Sales Sights by Region
8.1 By Region, Global Semiconductor Underfill Consumption Value, 2020 VS 2024 VS 2031
8.2 By Region, Global Semiconductor Underfill Consumption Value, 2020-2031
8.3 By Region, Global Semiconductor Underfill Sales Quantity, 2020-2031
8.4 North America
8.4.1 North America Semiconductor Underfill Market Size & Forecasts, 2020-2031
8.4.2 By Country, North America Semiconductor Underfill Market Size Market Share
8.5 Europe
8.5.1 Europe Semiconductor Underfill Market Size & Forecasts, 2020-2031
8.5.2 By Country, Europe Semiconductor Underfill Market Size Market Share
8.6 Asia Pacific
8.6.1 Asia Pacific Semiconductor Underfill Market Size & Forecasts, 2020-2031
8.6.2 By Country/Region, Asia Pacific Semiconductor Underfill Market Size Market Share
8.7 South America
8.7.1 South America Semiconductor Underfill Market Size & Forecasts, 2020-2031
8.7.2 By Country, South America Semiconductor Underfill Market Size Market Share
8.8 Middle East & Africa

9 Sales Sights by Country Level
9.1 By Country, Global Semiconductor Underfill Market Size & CAGR, 2020 VS 2024 VS 2031
9.2 By Country, Global Semiconductor Underfill Consumption Value, 2020-2031
9.3 By Country, Global Semiconductor Underfill Sales Quantity, 2020-2031
9.4 United States
9.4.1 United States Semiconductor Underfill Market Size, 2020-2031
9.4.2 by Type, United States Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.4.3 by Application, United States Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.5 Europe
9.5.1 Europe Semiconductor Underfill Market Size, 2020-2031
9.5.2 by Type, Europe Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.5.3 by Application, Europe Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.6 China
9.6.1 China Semiconductor Underfill Market Size, 2020-2031
9.6.2 by Type, China Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.6.3 by Application, China Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.7 Japan
9.7.1 Japan Semiconductor Underfill Market Size, 2020-2031
9.7.2 by Type, Japan Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.7.3 by Application, Japan Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.8 South Korea
9.8.1 South Korea Semiconductor Underfill Market Size, 2020-2031
9.8.2 by Type, South Korea Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.8.3 by Application, South Korea Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.9 Southeast Asia
9.9.1 Southeast Asia Semiconductor Underfill Market Size, 2020-2031
9.9.2 by Type, Southeast Asia Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.9.3 by Application, Southeast Asia Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.10 India
9.10.1 India Semiconductor Underfill Market Size, 2020-2031
9.10.2 by Type, India Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.10.3 by Application, India Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.11 Middle East & Africa
9.11.1 Middle East & Africa Semiconductor Underfill Market Size, 2020-2031
9.11.2 by Type, Middle East & Africa Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031
9.11.3 by Application, Middle East & Africa Semiconductor Underfill Sales Quantity Market Share, 2024 VS 2031

10 Manufacturers Profile
10.1 Henkel
10.1.1 Henkel Company Information, Head Office, Market Area, and Industry Position
10.1.2 Henkel Semiconductor Underfill Models, Specifications, and Application
10.1.3 Henkel Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.1.4 Henkel Company Profile and Main Business
10.1.5 Henkel Recent Developments
10.2 NAMICS
10.2.1 NAMICS Company Information, Head Office, Market Area, and Industry Position
10.2.2 NAMICS Semiconductor Underfill Models, Specifications, and Application
10.2.3 NAMICS Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.2.4 NAMICS Company Profile and Main Business
10.2.5 NAMICS Recent Developments
10.3 LORD Corporation
10.3.1 LORD Corporation Company Information, Head Office, Market Area, and Industry Position
10.3.2 LORD Corporation Semiconductor Underfill Models, Specifications, and Application
10.3.3 LORD Corporation Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.3.4 LORD Corporation Company Profile and Main Business
10.3.5 LORD Corporation Recent Developments
10.4 Panacol
10.4.1 Panacol Company Information, Head Office, Market Area, and Industry Position
10.4.2 Panacol Semiconductor Underfill Models, Specifications, and Application
10.4.3 Panacol Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.4.4 Panacol Company Profile and Main Business
10.4.5 Panacol Recent Developments
10.5 Won Chemical
10.5.1 Won Chemical Company Information, Head Office, Market Area, and Industry Position
10.5.2 Won Chemical Semiconductor Underfill Models, Specifications, and Application
10.5.3 Won Chemical Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.5.4 Won Chemical Company Profile and Main Business
10.5.5 Won Chemical Recent Developments
10.6 Showa Denko
10.6.1 Showa Denko Company Information, Head Office, Market Area, and Industry Position
10.6.2 Showa Denko Semiconductor Underfill Models, Specifications, and Application
10.6.3 Showa Denko Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.6.4 Showa Denko Company Profile and Main Business
10.6.5 Showa Denko Recent Developments
10.7 Shin-Etsu Chemical
10.7.1 Shin-Etsu Chemical Company Information, Head Office, Market Area, and Industry Position
10.7.2 Shin-Etsu Chemical Semiconductor Underfill Models, Specifications, and Application
10.7.3 Shin-Etsu Chemical Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.7.4 Shin-Etsu Chemical Company Profile and Main Business
10.7.5 Shin-Etsu Chemical Recent Developments
10.8 AIM Solder
10.8.1 AIM Solder Company Information, Head Office, Market Area, and Industry Position
10.8.2 AIM Solder Semiconductor Underfill Models, Specifications, and Application
10.8.3 AIM Solder Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.8.4 AIM Solder Company Profile and Main Business
10.8.5 AIM Solder Recent Developments
10.9 Zymet
10.9.1 Zymet Company Information, Head Office, Market Area, and Industry Position
10.9.2 Zymet Semiconductor Underfill Models, Specifications, and Application
10.9.3 Zymet Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.9.4 Zymet Company Profile and Main Business
10.9.5 Zymet Recent Developments
10.10 Master Bond
10.10.1 Master Bond Company Information, Head Office, Market Area, and Industry Position
10.10.2 Master Bond Semiconductor Underfill Models, Specifications, and Application
10.10.3 Master Bond Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.10.4 Master Bond Company Profile and Main Business
10.10.5 Master Bond Recent Developments
10.11 Bondline
10.11.1 Bondline Company Information, Head Office, Market Area, and Industry Position
10.11.2 Bondline Semiconductor Underfill Models, Specifications, and Application
10.11.3 Bondline Semiconductor Underfill Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
10.11.4 Bondline Company Profile and Main Business
10.11.5 Bondline Recent Developments

11 Conclusion

12 Appendix
12.1 Research Methodology
12.2 Data Source
12.2.1 Secondary Sources
12.2.2 Primary Sources
12.3 Market Estimation Model
12.4 Disclaimer

According to YH Research, the global market for Semiconductor Underfill should grow from US$ 767 million in 2024 to US$ 1484 million by 2031, with a CAGR of 9.9% for the period of 2025-2031.

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Semiconductor Underfill

According to YH Research, the global market for Semiconductor Underfill should grow from US$ 767 million in 2024 to US$ 1484 million by 2031, with a CAGR of 9.9% for the period of 2025-2031.

Unit: US$ M

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In-depth insight into market trends

According to market research, the global output of semiconductor underfill in 2024 is estimated to be approximately 250–300 tons. Prices vary significantly depending on product specifications, with an overall price range of $2,500–3,000 per kilogram.

Semiconductor underfill is a type of material used to fill the gap between the chip and the substrate in semiconductor packaging. Its primary purpose is to enhance the mechanical strength and thermal shock resistance of semiconductor packages. Typically composed of resin, hardeners, and fillers, underfill materials infiltrate the gap between the chip and substrate and form a robust network structure during thermal curing. As semiconductor technology continues to advance, particularly with increasing integration, the demand for packaging technology has grown significantly, and underfill materials, as a key component in packaging, are seeing a rising demand.

In recent years, the rapid development of sectors like 5G communication, the Internet of Things (IoT), and automotive electronics has spurred growth in the semiconductor industry, driving innovation in packaging technologies. In particular, underfill materials play a critical role in enhancing packaging reliability, extending service life, and improving thermal management, driven by the demands for miniaturization, high frequency, and low power consumption. As a result, the underfill market holds promising potential, with major semiconductor packaging companies increasing their research and development efforts to drive market growth.

The semiconductor underfill market is experiencing unprecedented opportunities, particularly with the fast growth of industries such as 5G, IoT, and automotive electronics. As the demand for high-performance, highly reliable semiconductor packaging continues to rise, underfill materials, an essential part of the packaging process, significantly contribute to improving the reliability and stability of semiconductor packages. Additionally, advancements in underfill material technologies, along with the introduction of new materials and technologies, are enhancing the market competitiveness of underfill materials.

Despite its promising market outlook, the semiconductor underfill industry faces several challenges. On one hand, the materials and processing technologies for underfill are still developing, leading to high research and development costs. On the other hand, there is a broad range of products introduced by various manufacturers, with varying levels of product performance and quality, leading to intense market competition. Additionally, fluctuations in raw material prices and the complexity of the production process may pose risks to the industry's growth.

With the rise of industries such as 5G, automotive electronics, and artificial intelligence, downstream demand for semiconductor packaging is becoming more diverse. In these applications, the demand for high-performance, highly reliable, and low-power packaging technologies is increasing, which is driving the growth of the semiconductor underfill market. In particular, the need for better thermal management and signal integrity is making the demand for underfill materials more diversified, and this trend is expected to continue, sustaining growth in the field in the future.

This report studies and analyses global Semiconductor Underfill status and future trends, helps the client to determine the Semiconductor Underfill market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Semiconductor Underfill, and provides market size (in Tons & US$ million) and Year-over-Year growth, considering 2024 as the base year.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

To assess the competitive environment within the market including supplier revenue, market share, and company profiles.

Highlights
(1) Global Semiconductor Underfill market size, history data 2020-2025, and forecast data 2026-2031, (US$ million) & (Tons)
(2) Global Semiconductor Underfill sales, revenue, price by company, market share and industry ranking 2020-2025, (US$ million) & (Tons)
(3) China Semiconductor Underfill sales, revenue, price by company, market share and industry ranking 2020-2025, (US$ million) & (Tons)
(4) Global Semiconductor Underfill key consuming regions, consumption quantity, consumption value and demand structure
(5) Global Semiconductor Underfill key producing regions, capacity, production, and year over year growth
(6) Semiconductor Underfill industry chains, upstream, midstream and downstream
Market segment by players, this report covers
Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Showa Denko
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline

Market segment by Type, covers
CUF
NCP/NCF

Market segment by Application, can be divided into
Automotive
Telecommunication
Consumer Electronics
Other

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe Semiconductor Underfill product scope, global sales quantity, value and average price, China sales quantity, value and average price, development opportunities, challenges, trends, and policies.
Chapter 2: Global Semiconductor Underfill market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2025
Chapter 3: China Semiconductor Underfill market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2025
Chapter 4: Global key producing regions of Semiconductor Underfill, percent & CAGR, 2020-2031
Chapter 5: Semiconductor Underfill industry chain, upstream, medium-stream, and downstream.
Chapter 6: Segment by Type, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 7: Segment by Application, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 8: Segment in regional level, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 9: Segment in country level, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 10: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, sales quantity, average price, revenue, gross margin.