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Total 128449 Records | 12845 Pages
2024-2030 Global AMHS for Cleanroom Industry Research & Trends Analysis Report
This report studies the AMHS for Semiconductor and Flat Panel Display.
2024-05-17
Electronics & SemiconductorUSD5200
This report studies the AMHS for Semiconductor and Flat Panel Display.
2024-05-17 Electronics & SemiconductorUSD5200
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2024-2030 Global AR/VR SoC Industry Research & Trends Analysis Report
AR/VR SoC stands for Augmented Reality/Virtual Reality System-on-Chip. It refers to a specialized integrated circuit that combines various components required for processing and rendering AR (Augmented Reality) and VR (Virtual Reality) experiences into a single chip. These components typically include CPU (Central Processing Unit), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), memory controllers, I/O interfaces, and other specialized hardware accelerators tailored for AR/VR applications. The purpose of an AR/VR SoC is to optimize performance, power efficiency, and cost-effectiveness for AR and VR devices such as headsets, glasses, and other wearable gadgets. By integrating multiple functions into a single chip, AR/VR SoCs can enable smoother and more immersive user experiences while minimizing the power consumption and physical footprint of the devices. They are essential for pushing the boundaries of AR and VR technology and making these experiences more accessible to consumers.
2024-05-17 Electronics & SemiconductorUSD5200
AR/VR SoC stands for Augmented Reality/Virtual Reality System-on-Chip. It refers to a specialized integrated circuit that combines various components required for processing and rendering AR (Augmented Reality) and VR (Virtual Reality) experiences into a single chip. These components typically include CPU (Central Processing Unit), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), memory controllers, I/O interfaces, and other specialized hardware accelerators tailored for AR/VR applications. The purpose of an AR/VR SoC is to optimize performance, power efficiency, and cost-effectiveness for AR and VR devices such as headsets, glasses, and other wearable gadgets. By integrating multiple functions into a single chip, AR/VR SoCs can enable smoother and more immersive user experiences while minimizing the power consumption and physical footprint of the devices. They are essential for pushing the boundaries of AR and VR technology and making these experiences more accessible to consumers.
2024-05-17 Electronics & SemiconductorUSD5200
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2024-2030 Global AMHS for Semiconductor Industry Research & Trends Analysis Report
The semiconductor wafer clean room automatic handling system (AMHS) is mainly composed of two parts: the hardware structure (storage unit + handling unit) and the control system. In semiconductor processing plants, AMHS systems (Automated Material Handling Systems) are very critical and are the guarantee of improving semiconductor manufacturing yield, yield and equipment utilization. Especially for fully automated semiconductor factories that realize automatic transfer between production equipment and equipment, an efficient AMHS system can greatly reduce the waiting time of in-process products, thereby shortening the production cycle of wafer products. AMHS has experienced rapid development from mechanical transport to unmanned transport. The early 6-inch fab was not widely used due to the limited weight of the wafer itself. Later, with the rise of the 8-inch fab, the application of AMHS began to flourish. It has successively experienced the first-generation unit air transport system, the second-generation EQtoEQ partial cross-regional direct transport, the third-generation plant-wide EQtoEQ AMHS system, and then the fourth generation AMHS, Stocker+OHT+ZFS. The fourth generation AMHS system is an automatic material conveying system that uses multi-fork in the air and does not need to wait. The speed of conveying the wafer cassette is very fast (≥3 m/s), it can move in a curve or climb a slope, without adding a transfer unit, swinging. Small, effectively control the generation of particulate matter. In order to solve the problem of possible congestion in conveyance, the concepts of dynamic load balancing and dynamic task assignment are proposed. In order to reduce the footprint, the early stocker storage warehouse is placed in the aerial wafer storage device UTS. Reduce costs, the use of UTS reduces the number of Stockers, thereby reducing fixed investment, improving equipment reliability, and saving regular maintenance costs. The dynamic decision-making function of the AMHS system makes the AMHS system transition from the early design concept of shortening the production cycle through rapid mechanical movement to the new concept of intelligently controlling the position of the aerial carrier and rationally dispatching workers, giving full play to the role of production assistance and bringing the fab to the fab. more added value.
2024-05-17 Electronics & SemiconductorUSD5200
The semiconductor wafer clean room automatic handling system (AMHS) is mainly composed of two parts: the hardware structure (storage unit + handling unit) and the control system. In semiconductor processing plants, AMHS systems (Automated Material Handling Systems) are very critical and are the guarantee of improving semiconductor manufacturing yield, yield and equipment utilization. Especially for fully automated semiconductor factories that realize automatic transfer between production equipment and equipment, an efficient AMHS system can greatly reduce the waiting time of in-process products, thereby shortening the production cycle of wafer products. AMHS has experienced rapid development from mechanical transport to unmanned transport. The early 6-inch fab was not widely used due to the limited weight of the wafer itself. Later, with the rise of the 8-inch fab, the application of AMHS began to flourish. It has successively experienced the first-generation unit air transport system, the second-generation EQtoEQ partial cross-regional direct transport, the third-generation plant-wide EQtoEQ AMHS system, and then the fourth generation AMHS, Stocker+OHT+ZFS. The fourth generation AMHS system is an automatic material conveying system that uses multi-fork in the air and does not need to wait. The speed of conveying the wafer cassette is very fast (≥3 m/s), it can move in a curve or climb a slope, without adding a transfer unit, swinging. Small, effectively control the generation of particulate matter. In order to solve the problem of possible congestion in conveyance, the concepts of dynamic load balancing and dynamic task assignment are proposed. In order to reduce the footprint, the early stocker storage warehouse is placed in the aerial wafer storage device UTS. Reduce costs, the use of UTS reduces the number of Stockers, thereby reducing fixed investment, improving equipment reliability, and saving regular maintenance costs. The dynamic decision-making function of the AMHS system makes the AMHS system transition from the early design concept of shortening the production cycle through rapid mechanical movement to the new concept of intelligently controlling the position of the aerial carrier and rationally dispatching workers, giving full play to the role of production assistance and bringing the fab to the fab. more added value.
2024-05-17 Electronics & SemiconductorUSD5200
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Non-Conductive Film for Semiconductor (HBM) - Global and China Top Players Market Share and Ranking 2024
Non-Conductive Film (NCF) is applied for 3D-package which consists of stacking of Through Silicon Via (TSV) memory with narrow bump pitch and narrow gap. In HBM, NCF is the core factor that determines heat and semiconductor height.
2024-05-17 Electronics & SemiconductorUSD3060
Non-Conductive Film (NCF) is applied for 3D-package which consists of stacking of Through Silicon Via (TSV) memory with narrow bump pitch and narrow gap. In HBM, NCF is the core factor that determines heat and semiconductor height.
2024-05-17 Electronics & SemiconductorUSD3060
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AMHS for Cleanroom - Global and China Top Players Market Share and Ranking 2024
This report studies the AMHS for Semiconductor and Flat Panel Display.
2024-05-17 Electronics & SemiconductorUSD3060
This report studies the AMHS for Semiconductor and Flat Panel Display.
2024-05-17 Electronics & SemiconductorUSD3060
View Details
AR/VR SoC - Global and China Top Players Market Share and Ranking 2024
AR/VR SoC stands for Augmented Reality/Virtual Reality System-on-Chip. It refers to a specialized integrated circuit that combines various components required for processing and rendering AR (Augmented Reality) and VR (Virtual Reality) experiences into a single chip. These components typically include CPU (Central Processing Unit), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), memory controllers, I/O interfaces, and other specialized hardware accelerators tailored for AR/VR applications. The purpose of an AR/VR SoC is to optimize performance, power efficiency, and cost-effectiveness for AR and VR devices such as headsets, glasses, and other wearable gadgets. By integrating multiple functions into a single chip, AR/VR SoCs can enable smoother and more immersive user experiences while minimizing the power consumption and physical footprint of the devices. They are essential for pushing the boundaries of AR and VR technology and making these experiences more accessible to consumers.
2024-05-17 Electronics & SemiconductorUSD3060
AR/VR SoC stands for Augmented Reality/Virtual Reality System-on-Chip. It refers to a specialized integrated circuit that combines various components required for processing and rendering AR (Augmented Reality) and VR (Virtual Reality) experiences into a single chip. These components typically include CPU (Central Processing Unit), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), memory controllers, I/O interfaces, and other specialized hardware accelerators tailored for AR/VR applications. The purpose of an AR/VR SoC is to optimize performance, power efficiency, and cost-effectiveness for AR and VR devices such as headsets, glasses, and other wearable gadgets. By integrating multiple functions into a single chip, AR/VR SoCs can enable smoother and more immersive user experiences while minimizing the power consumption and physical footprint of the devices. They are essential for pushing the boundaries of AR and VR technology and making these experiences more accessible to consumers.
2024-05-17 Electronics & SemiconductorUSD3060
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RF Circulators - Global and China Top Players Market Share and Ranking 2024
An RF Circulator is a 3 Port ferromagnetic device used to regulate the signal flow within a circuit. It transmits an input signal in one direction – A signal that enters port 1 is transmitted to port 2 and isolated from port 3, a signal incident at port 2 is transmitted to port 3 and isolated from port 1, a signal incident at port 3 is transmitted to port 1 and isolated from port 2. Circulators are typically designed to have minimal loss when transmitting an input signal from one port to the next.
2024-05-17 Electronics & SemiconductorUSD3060
An RF Circulator is a 3 Port ferromagnetic device used to regulate the signal flow within a circuit. It transmits an input signal in one direction – A signal that enters port 1 is transmitted to port 2 and isolated from port 3, a signal incident at port 2 is transmitted to port 3 and isolated from port 1, a signal incident at port 3 is transmitted to port 1 and isolated from port 2. Circulators are typically designed to have minimal loss when transmitting an input signal from one port to the next.
2024-05-17 Electronics & SemiconductorUSD3060
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Centrifugal Cooling Fans - Global and China Top Players Market Share and Ranking 2024
The cooling fans market and manufacturers are separated into two major group. If we divide them by the size of the fans, we can consider 200mm is the border. Different manufacturers and application could deviate it (200mm). The size above 200mm cooling fans market demand comes from ventilation, agriculture, mining, marine etc. The manufacturers in this area typically are EBM, ZIEHL, Aerovent, DELTA, Roserberg, etc. Even though you may see Aerovent says they also provide fans for automotive, but actually not. Their fans are only for ventilation system in automotive factory. The size below and equal to 200mm market demand comes from Automobile and Transportation, consumer, telecom, Home Appliance etc. and it is used for cooling the environment of machine working. The manufacturers are DELTA, NIDEC, NMB, SUNON, ADDA, EBM, AVC, Sanyo Denki, etc. High pressure increase at limited flow rate. Generally, many cooling tasks can be performed excellently by axial and/or diagonal fans. But if the cooling airflow has to be deflected at an angle of 90°, for example, or if even greater pressure increase is necessary, centrifugal fans are more effective.
2024-05-17 Electronics & SemiconductorUSD3060
The cooling fans market and manufacturers are separated into two major group. If we divide them by the size of the fans, we can consider 200mm is the border. Different manufacturers and application could deviate it (200mm). The size above 200mm cooling fans market demand comes from ventilation, agriculture, mining, marine etc. The manufacturers in this area typically are EBM, ZIEHL, Aerovent, DELTA, Roserberg, etc. Even though you may see Aerovent says they also provide fans for automotive, but actually not. Their fans are only for ventilation system in automotive factory. The size below and equal to 200mm market demand comes from Automobile and Transportation, consumer, telecom, Home Appliance etc. and it is used for cooling the environment of machine working. The manufacturers are DELTA, NIDEC, NMB, SUNON, ADDA, EBM, AVC, Sanyo Denki, etc. High pressure increase at limited flow rate. Generally, many cooling tasks can be performed excellently by axial and/or diagonal fans. But if the cooling airflow has to be deflected at an angle of 90°, for example, or if even greater pressure increase is necessary, centrifugal fans are more effective.
2024-05-17 Electronics & SemiconductorUSD3060
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Ceramic Electro Static Chuck - Global and China Top Players Market Share and Ranking 2024
Ceramic Electro Static Chuck is an ultra-clean wafer carrier suitable for vacuum environment or plasma environment. It uses the principle of electrostatic adsorption to clamp ultra-thin wafers evenly and evenly. This product is widely used in high-end semiconductor manufacturing equipment such as PVD, PECVD, ETCH, EUVL, and ion implantation. The basic structure of an electrostatic chuck consists of a conductive base, typically made of metal or semiconductor material, and an insulating layer, often made of ceramic or polymer material, on top of which the workpiece rests. Beneath the insulating layer, there are electrodes connected to a power source. When a voltage is applied between the conductive base and the electrodes, an electric field is generated in the insulating layer, creating electrostatic forces that hold the workpiece in place. Electrostatic chucks offer several advantages over mechanical clamping systems, including: Uniform clamping force: Electrostatic chucks can distribute the clamping force evenly across the entire surface of the workpiece, ensuring uniform contact and minimizing the risk of distortion or damage. Non-contact clamping: Since electrostatic chucks rely on electrostatic forces to hold the workpiece, there is no physical contact between the chuck and the workpiece, reducing the risk of contamination or damage to delicate surfaces. High precision and repeatability: Electrostatic chucks provide precise control over the clamping force, allowing for accurate positioning and alignment of the workpiece. Additionally, they offer excellent repeatability, ensuring consistent results over multiple processing cycles. Compatibility with various materials: Electrostatic chucks can be used with a wide range of materials, including semiconductors, ceramics, glass, and metals, making them suitable for diverse manufacturing applications. Overall, Ceramic Electro Static Chucks play critical roles in semiconductor, flat panel display, and various other industries where precise substrate handling, positioning, and processing are essential for achieving high-quality products and devices.
2024-05-17 Electronics & SemiconductorUSD3060
Ceramic Electro Static Chuck is an ultra-clean wafer carrier suitable for vacuum environment or plasma environment. It uses the principle of electrostatic adsorption to clamp ultra-thin wafers evenly and evenly. This product is widely used in high-end semiconductor manufacturing equipment such as PVD, PECVD, ETCH, EUVL, and ion implantation. The basic structure of an electrostatic chuck consists of a conductive base, typically made of metal or semiconductor material, and an insulating layer, often made of ceramic or polymer material, on top of which the workpiece rests. Beneath the insulating layer, there are electrodes connected to a power source. When a voltage is applied between the conductive base and the electrodes, an electric field is generated in the insulating layer, creating electrostatic forces that hold the workpiece in place. Electrostatic chucks offer several advantages over mechanical clamping systems, including: Uniform clamping force: Electrostatic chucks can distribute the clamping force evenly across the entire surface of the workpiece, ensuring uniform contact and minimizing the risk of distortion or damage. Non-contact clamping: Since electrostatic chucks rely on electrostatic forces to hold the workpiece, there is no physical contact between the chuck and the workpiece, reducing the risk of contamination or damage to delicate surfaces. High precision and repeatability: Electrostatic chucks provide precise control over the clamping force, allowing for accurate positioning and alignment of the workpiece. Additionally, they offer excellent repeatability, ensuring consistent results over multiple processing cycles. Compatibility with various materials: Electrostatic chucks can be used with a wide range of materials, including semiconductors, ceramics, glass, and metals, making them suitable for diverse manufacturing applications. Overall, Ceramic Electro Static Chucks play critical roles in semiconductor, flat panel display, and various other industries where precise substrate handling, positioning, and processing are essential for achieving high-quality products and devices.
2024-05-17 Electronics & SemiconductorUSD3060
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Electric Mobility Scooter - Global and China Top Players Market Share and Ranking 2024
An electric mobility scooter is a mobility aid equivalent to a wheelchair but configured like a motorscooter, mostly occupied by single person. These electric mobility scooters are operated on battery and are varies from 3 wheels to 5 wheels.
2024-05-17 Electronics & SemiconductorUSD3060
An electric mobility scooter is a mobility aid equivalent to a wheelchair but configured like a motorscooter, mostly occupied by single person. These electric mobility scooters are operated on battery and are varies from 3 wheels to 5 wheels.
2024-05-17 Electronics & SemiconductorUSD3060
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