2025-2031 Global Computing Power Heat Dissipation Structural Components Industry Research & Trends Analysis Report- YH Research

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2025-2031 Global Computing Power Heat Dissipation Structural Components Industry Research & Trends Analysis Report

Publication Date: 2025-08-28
Report Id: 2368245
Industry: Machinery & Equipment
Report Page: 134
Chart: 134

PDF Download

Publication Date: 2025-08-28
Report Id: 2368245
Industry: Machinery & Equipment
Report Page: 134
Chart: 134

PDF Download

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Table of Contents
Description
Table of Figures
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1 Market Overview
1.1 Computing Power Heat Dissipation Structural Components Definition
1.2 Global Computing Power Heat Dissipation Structural Components Market Size and Forecast
1.2.1 By Revenue, Global Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
1.2.2 By Sales Volume, Global Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
1.2.3 Global Computing Power Heat Dissipation Structural Components Price Trend, 2020-2031
1.3 China Computing Power Heat Dissipation Structural Components Market Size and Forecast
1.3.1 By Revenue, China Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
1.3.2 By Sales Volume, China Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
1.3.3 China Computing Power Heat Dissipation Structural Components Price Trend, 2020-2031
1.4 China Percentage in Global Market
1.4.1 By Revenue, China Computing Power Heat Dissipation Structural Components Share in Global Market, 2020-2031
1.4.2 By Sales Volume, China Computing Power Heat Dissipation Structural Components Share in Global Market, 2020-2031
1.4.3 Computing Power Heat Dissipation Structural Components Market Size: China VS Global, 2020-2031
1.5 Computing Power Heat Dissipation Structural Components Market Dynamics
1.5.1 Computing Power Heat Dissipation Structural Components Market Drivers
1.5.2 Computing Power Heat Dissipation Structural Components Market Restraints
1.5.3 Computing Power Heat Dissipation Structural Components Industry Trends
1.5.4 Computing Power Heat Dissipation Structural Components Industry Policy

2 Global Competitive Landscape by Company
2.1 Global Computing Power Heat Dissipation Structural Components Revenue by Company, 2020-2025
2.2 Global Computing Power Heat Dissipation Structural Components Sales Volume by Company, 2020-2025
2.3 Global Computing Power Heat Dissipation Structural Components Price by Company, 2020-2025
2.4 Global Computing Power Heat Dissipation Structural Components Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.5 Global Computing Power Heat Dissipation Structural Components Concentration Ratio
2.6 Global Computing Power Heat Dissipation Structural Components Mergers & Acquisitions, Expansion Plans
2.7 Global Computing Power Heat Dissipation Structural Components Manufacturers Product Type

3 China Competitive Landscape by Company
3.1 China Computing Power Heat Dissipation Structural Components Revenue by Company, 2020-2025
3.2 China Computing Power Heat Dissipation Structural Components Sales Volume by Company, 2020-2025
3.3 China Computing Power Heat Dissipation Structural Components Computing Power Heat Dissipation Structural Components Participants, Market Position (Tier 1, Tier 2, and Tier 3)
3.4 China Computing Power Heat Dissipation Structural Components Market, Sales Percentage of Local Players VS Foreign Players (2020-2025)
3.5 Chinese Local Players, Computing Power Heat Dissipation Structural Components Domestic VS Export
3.6 China Market, Computing Power Heat Dissipation Structural Components Import & Export
3.6.1 China Market, Computing Power Heat Dissipation Structural Components Import & Export, 2020-2031
3.6.2 China Computing Power Heat Dissipation Structural Components Import & Export Trends
3.6.3 Main Sources of China Computing Power Heat Dissipation Structural Components Import
3.6.4 Export Destination of China Computing Power Heat Dissipation Structural Components

4 Computing Power Heat Dissipation Structural Components Production by Region
4.1 Global Computing Power Heat Dissipation Structural Components Capacity, Production and Capacity Utilization, 2020-2031
4.2 Global Geographic Distribution of Computing Power Heat Dissipation Structural Components Manufacturers
4.3 Global Major Manufacturers, Computing Power Heat Dissipation Structural Components Capacity Expansion and Future Plans
4.4 Global Computing Power Heat Dissipation Structural Components Capacity by Region
4.5 Global Computing Power Heat Dissipation Structural Components Production by Region
4.5.1 Global Computing Power Heat Dissipation Structural Components Production & Forecast by Region, 2020 VS 2024 VS 2031
4.5.2 Global Computing Power Heat Dissipation Structural Components Production by Region, 2020-2025
4.5.3 Global Computing Power Heat Dissipation Structural Components Production Market Share & Forecast by Region, 2020-2031

5 Industry Chain Analysis
5.1 Computing Power Heat Dissipation Structural Components Industry Chain
5.2 Computing Power Heat Dissipation Structural Components Upstream Analysis
5.2.1 Computing Power Heat Dissipation Structural Components Core Raw Materials
5.2.2 Main Manufacturers of Computing Power Heat Dissipation Structural Components Core Raw Materials
5.3 Midstream Analysis
5.4 Downstream Analysis
5.5 Computing Power Heat Dissipation Structural Components Production Mode
5.6 Computing Power Heat Dissipation Structural Components Procurement Model
5.7 Computing Power Heat Dissipation Structural Components Industry Sales Model and Sales Channels
5.7.1 Computing Power Heat Dissipation Structural Components Sales Model
5.7.2 Computing Power Heat Dissipation Structural Components Typical Distributors

6 Sights by Type
6.1 Computing Power Heat Dissipation Structural Components Classification by Type
6.1.1 Air-cooled
6.1.2 Liquid-cooled
6.2 by Type, Global Computing Power Heat Dissipation Structural Components Market Size & CAGR, 2020 VS 2024 VS 2031
6.3 by Type, Global Computing Power Heat Dissipation Structural Components Revenue, 2020-2031
6.4 by Type, Global Computing Power Heat Dissipation Structural Components Sales Volume, 2020-2031
6.5 by Type, Global Computing Power Heat Dissipation Structural Components Price, 2020-2031

7 Sights by Application
7.1 Computing Power Heat Dissipation Structural Components Segment by Application
7.1.1 Server
7.1.2 Consumer Electronics
7.1.3 Telecommunication Equipment
7.1.4 Other
7.2 by Application, Global Computing Power Heat Dissipation Structural Components Market Size & CAGR, 2020 VS 2024 VS 2031
7.3 by Application, Global Computing Power Heat Dissipation Structural Components Revenue, 2020-2031
7.4 by Application, Global Computing Power Heat Dissipation Structural Components Sales Volume, 2020-2031
7.5 by Application, Global Computing Power Heat Dissipation Structural Components Price, 2020-2031

8 Sales Sights by Region
8.1 By Region, Global Computing Power Heat Dissipation Structural Components Market Size, 2020 VS 2024 VS 2031
8.2 By Region, Global Computing Power Heat Dissipation Structural Components Revenue, 2020-2031
8.3 By Region, Global Computing Power Heat Dissipation Structural Components Sales Volume, 2020-2031
8.4 North America
8.4.1 North America Computing Power Heat Dissipation Structural Components Market Size & Forecasts, 2020-2031
8.4.2 By Country, North America Computing Power Heat Dissipation Structural Components Market Size Market Share
8.5 Europe
8.5.1 Europe Computing Power Heat Dissipation Structural Components Market Size & Forecasts, 2020-2031
8.5.2 By Country, Europe Computing Power Heat Dissipation Structural Components Market Size Market Share
8.6 Asia Pacific
8.6.1 Asia Pacific Computing Power Heat Dissipation Structural Components Market Size & Forecasts, 2020-2031
8.6.2 By Country/Region, Asia Pacific Computing Power Heat Dissipation Structural Components Market Size Market Share
8.7 South America
8.7.1 South AmericaComputing Power Heat Dissipation Structural Components Market Size & Forecasts, 2020-2031
8.7.2 By Country, South America Computing Power Heat Dissipation Structural Components Market Size Market Share
8.8 Middle East & Africa

9 Sales Sights by Country Level
9.1 By Country, Global Computing Power Heat Dissipation Structural Components Market Size & CAGR，2020 VS 2024 VS 2031
9.2 By Country, Global Computing Power Heat Dissipation Structural Components Revenue, 2020-2031
9.3 By Country, Global Computing Power Heat Dissipation Structural Components Sales Volume, 2020-2031
9.4 United States
9.4.1 United States Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.4.2 By Company, United States Computing Power Heat Dissipation Structural Components Sales Volume Market Share, 2024
9.4.3 by Type, United States Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.4.4 by Application, United States Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.5 Europe
9.5.1 Europe Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.5.2 By Company, Europe Computing Power Heat Dissipation Structural Components Sales Volume Market Share, 2024
9.5.3 by Type, Europe Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.5.4 by Application, Europe Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.6 China
9.6.1 China Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.6.2 By Company, China Computing Power Heat Dissipation Structural Components Sales Volume Market Share, 2024
9.6.3 by Type, China Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.6.4 by Application, China Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.7 Japan
9.7.1 Japan Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.7.2 By Company, Japan Computing Power Heat Dissipation Structural Components Market Share, 2024
9.7.3 by Type, Japan Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.7.4 by Application, Japan Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.8 South Korea
9.8.1 South Korea Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.8.2 By Company, South Korea Computing Power Heat Dissipation Structural Components Market Share, 2024
9.8.3 by Type, South Korea Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.8.4 by Application, South Korea Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.9 Southeast Asia
9.9.1 Southeast Asia Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.9.2 By Company, Southeast Asia Computing Power Heat Dissipation Structural Components Market Share, 2024
9.9.3 by Type, Southeast Asia Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.9.4 by Application, Southeast Asia Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.10 India
9.10.1 India Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.10.2 By Company, India Computing Power Heat Dissipation Structural Components Market Share, 2024
9.10.3 by Type, India Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.10.4 by Application, India Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.11 Middle East & Africa
9.11.1 Middle East & Africa Computing Power Heat Dissipation Structural Components Market Size, 2020-2031
9.11.2 By Company, Middle East & Africa Computing Power Heat Dissipation Structural Components Market Share, 2024
9.11.3 by Type, Middle East & Africa Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031
9.11.4 by Application, Middle East & Africa Computing Power Heat Dissipation Structural Components Market Size, Share, 2024 VS 2031

10 Manufacturers Profile
10.1 Delta Electronics, Inc.
10.1.1 Delta Electronics, Inc. Company Information, Head Office, Market Area, and Industry Position
10.1.2 Delta Electronics, Inc. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.1.3 Delta Electronics, Inc. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.1.4 Delta Electronics, Inc. Company Profile and Main Business
10.1.5 Delta Electronics, Inc. Recent Developments
10.2 NIDEC CORPORATION
10.2.1 NIDEC CORPORATION Company Information, Head Office, Market Area, and Industry Position
10.2.2 NIDEC CORPORATION Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.2.3 NIDEC CORPORATION Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.2.4 NIDEC CORPORATION Company Profile and Main Business
10.2.5 NIDEC CORPORATION Recent Developments
10.3 Dongguan Manko Hardware Products Co., Ltd.
10.3.1 Dongguan Manko Hardware Products Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.3.2 Dongguan Manko Hardware Products Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.3.3 Dongguan Manko Hardware Products Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.3.4 Dongguan Manko Hardware Products Co., Ltd. Company Profile and Main Business
10.3.5 Dongguan Manko Hardware Products Co., Ltd. Recent Developments
10.4 Auras Technology Co., Ltd.
10.4.1 Auras Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.4.2 Auras Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.4.3 Auras Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.4.4 Auras Technology Co., Ltd. Company Profile and Main Business
10.4.5 Auras Technology Co., Ltd. Recent Developments
10.5 Jiangsu Gian Technology Co., Ltd.
10.5.1 Jiangsu Gian Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.5.2 Jiangsu Gian Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.5.3 Jiangsu Gian Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.5.4 Jiangsu Gian Technology Co., Ltd. Company Profile and Main Business
10.5.5 Jiangsu Gian Technology Co., Ltd. Recent Developments
10.6 Shenzhen FRD Technology Co., Ltd.
10.6.1 Shenzhen FRD Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.6.2 Shenzhen FRD Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.6.3 Shenzhen FRD Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.6.4 Shenzhen FRD Technology Co., Ltd. Company Profile and Main Business
10.6.5 Shenzhen FRD Technology Co., Ltd. Recent Developments
10.7 Casetek Precision Industrial Co., Ltd.
10.7.1 Casetek Precision Industrial Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.7.2 Casetek Precision Industrial Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.7.3 Casetek Precision Industrial Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.7.4 Casetek Precision Industrial Co., Ltd. Company Profile and Main Business
10.7.5 Casetek Precision Industrial Co., Ltd. Recent Developments
10.8 Beijing Zhongshi Weiye Technology Co., Ltd.
10.8.1 Beijing Zhongshi Weiye Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.8.2 Beijing Zhongshi Weiye Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.8.3 Beijing Zhongshi Weiye Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.8.4 Beijing Zhongshi Weiye Technology Co., Ltd. Company Profile and Main Business
10.8.5 Beijing Zhongshi Weiye Technology Co., Ltd. Recent Developments
10.9 Guangdong Lingyi Intelligent Manufacturing Co., Ltd.
10.9.1 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.9.2 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.9.3 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.9.4 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Company Profile and Main Business
10.9.5 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Recent Developments
10.10 Taico Electronic (Zhuhai) Co., Ltd.
10.10.1 Taico Electronic (Zhuhai) Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.10.2 Taico Electronic (Zhuhai) Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.10.3 Taico Electronic (Zhuhai) Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.10.4 Taico Electronic (Zhuhai) Co., Ltd. Company Profile and Main Business
10.10.5 Taico Electronic (Zhuhai) Co., Ltd. Recent Developments
10.11 Forcecon Technology Co., Ltd.
10.11.1 Forcecon Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.11.2 Forcecon Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.11.3 Forcecon Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.11.4 Forcecon Technology Co., Ltd. Company Profile and Main Business
10.11.5 Forcecon Technology Co., Ltd. Recent Developments
10.12 Suzhou Tianmai Thermal Technology Co., Ltd.
10.12.1 Suzhou Tianmai Thermal Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.12.2 Suzhou Tianmai Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.12.3 Suzhou Tianmai Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.12.4 Suzhou Tianmai Thermal Technology Co., Ltd. Company Profile and Main Business
10.12.5 Suzhou Tianmai Thermal Technology Co., Ltd. Recent Developments
10.13 QuanJing Technology Co., Ltd.
10.13.1 QuanJing Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.13.2 QuanJing Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.13.3 QuanJing Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.13.4 QuanJing Technology Co., Ltd. Company Profile and Main Business
10.13.5 QuanJing Technology Co., Ltd. Recent Developments
10.14 Shenzhen Winboth Thermal Technology Co., Ltd.
10.14.1 Shenzhen Winboth Thermal Technology Co., Ltd. Company Information, Head Office, Market Area, and Industry Position
10.14.2 Shenzhen Winboth Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Models, Specifications, and Application
10.14.3 Shenzhen Winboth Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales Volume, Revenue, Price and Gross Margin, 2020-2025
10.14.4 Shenzhen Winboth Thermal Technology Co., Ltd. Company Profile and Main Business
10.14.5 Shenzhen Winboth Thermal Technology Co., Ltd. Recent Developments

11 Conclusion

12 Appendix
12.1 Research Methodology
12.2 Data Source
12.2.1 Secondary Sources
12.2.2 Primary Sources
12.3 Market Estimation Model
12.4 Disclaimer

According to YH Research, the global market for Computing Power Heat Dissipation Structural Components should grow from US$ 775 million in 2024 to US$ 2485 million by 2031, with a CAGR of 19.3% for the period of 2025-2031.

The strategic recalibration of 2025 U.S. tariff mechanisms is redefining global economic governance norms. This study deciphers the transmission mechanisms of tariff escalation pathways and global policy responses on corporate investment strategies, regional trade networks, and critical material supply architectures.

Computing Power Heat Dissipation Structural Components

Unit: US$ M

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In-depth insight into market trends

In 2024, the price of computing power heat dissipation structural components was $4,049 per thousand units, with total sales reaching 180 million units.

Computing Power Heat Dissipation Structural Components are core metal structural parts that provide mechanical support and thermal conduction pathways for the cooling systems of high-performance computing devices (e.g., AI servers, GPU accelerators, data center switches). These components encompass precision die-cast/CNC-machined liquid cold plate substrates, high-thermal-conductivity fin array brackets, high-pressure-resistant sealed housings, and customized cooling frames for heterogeneous computing chips. They must meet stringent requirements for high heat flux density, multi-dimensional thermal topology, and long-term corrosion resistance. Their materials (e.g., copper alloys, aluminum silicon carbide) and manufacturing processes (e.g., ultra-thin channel milling, vacuum brazing) directly determine the cooling efficiency and reliability of computing equipment, serving as the critical physical interface between heat-generating units and active cooling components (e.g., liquid cooling pumps, immersion cooling systems).

China Computing Power Heat Dissipation Structural Components market should grow from US$ million in 2024 to US$ million by 2031, with a CAGR of % for the period of 2025-2031.

The United States Computing Power Heat Dissipation Structural Components market should grow from US$ million in 2024 to US$ million by 2031, with a CAGR of % for the period of 2025-2031.

In terms of product type, Air-cooled segment holds a share about % in 2024, and will reach % in 2031; while in terms of end use, Server has a share approximately % in 2024, and will grow at a CAGR % during 2025 and 2031.

The global key manufacturers of Computing Power Heat Dissipation Structural Components include Delta Electronics, Inc., NIDEC CORPORATION, Dongguan Manko Hardware Products Co., Ltd., Auras Technology Co., Ltd., Jiangsu Gian Technology Co., Ltd., Shenzhen FRD Technology Co., Ltd., Casetek Precision Industrial Co., Ltd., Beijing Zhongshi Weiye Technology Co., Ltd., Guangdong Lingyi Intelligent Manufacturing Co., Ltd., Taico Electronic (Zhuhai) Co., Ltd., etc. In 2024, the global top five players hold a share approximately % in terms of revenue.

This report aims to provide a comprehensive study of the global market for Computing Power Heat Dissipation Structural Components.
Report Highlights:
(1) Global Computing Power Heat Dissipation Structural Components market size (sales volume & revenue), history data from 2020-2025, and forecast data from 2026 to 2031.

(2) Global Computing Power Heat Dissipation Structural Components market competitive situation, sales, revenue, price, and market share, from 2020 to 2025.

(3) China Computing Power Heat Dissipation Structural Components market competitive situation, sales, revenue, price, and market share, from 2020 to 2025.

(4) Global Computing Power Heat Dissipation Structural Components segment by region (or country), key regions cover the United States, Europe, China, Japan, South Korea, Southeast Asia, and India, etc.

(5) Global Computing Power Heat Dissipation Structural Components segment by Type, and by Application, and regional segment by Type, and by Application.

(6) Global major production regions of Computing Power Heat Dissipation Structural Components, capacity, production and trends.

(7) Computing Power Heat Dissipation Structural Components industry supply chain, upstream, midstream, and downstream analysis.

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Market segment by Type, covers
Air-cooled
Liquid-cooled

Market segment by Application, can be divided into
Server
Consumer Electronics
Telecommunication Equipment
Other

Market segment by players, this report covers
Delta Electronics, Inc.
NIDEC CORPORATION
Dongguan Manko Hardware Products Co., Ltd.
Auras Technology Co., Ltd.
Jiangsu Gian Technology Co., Ltd.
Shenzhen FRD Technology Co., Ltd.
Casetek Precision Industrial Co., Ltd.
Beijing Zhongshi Weiye Technology Co., Ltd.
Guangdong Lingyi Intelligent Manufacturing Co., Ltd.
Taico Electronic (Zhuhai) Co., Ltd.
Forcecon Technology Co., Ltd.
Suzhou Tianmai Thermal Technology Co., Ltd.
QuanJing Technology Co., Ltd.
Shenzhen Winboth Thermal Technology Co., Ltd.