Through Glass Via (TGV) Technology - Global Top Players Market Share and Ranking 2025- YH Research

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Through Glass Via (TGV) Technology - Global Top Players Market Share and Ranking 2025

Publication Date: 2025-09-26
Report Id: 2460856
Industry: New Technology
Report Page: 96
Chart: 91

PDF Download

Publication Date: 2025-09-26
Report Id: 2460856
Industry: New Technology
Report Page: 96
Chart: 91

PDF Download

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Table of Contents
Description
Table of Figures
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1 Market Overview
1.1 Through Glass Via (TGV) Technology Definition
1.2 Global Through Glass Via (TGV) Technology Market Size and Forecast
1.3 China Through Glass Via (TGV) Technology Market Size and Forecast
1.4 Share of China Through Glass Via (TGV) Technology Market with Respect to the Global Market
1.5 Through Glass Via (TGV) Technology Market Size: China VS Global Growth Rate, 2020-2031
1.6 Through Glass Via (TGV) Technology Market Dynamics
1.6.1 Through Glass Via (TGV) Technology Market Drivers
1.6.2 Through Glass Via (TGV) Technology Market Restraints
1.6.3 Through Glass Via (TGV) Technology Industry Trends
1.6.4 Through Glass Via (TGV) Technology Industry Policy

2 Global Leading Players and Market Share
2.1 By Revenue of Through Glass Via (TGV) Technology, Global Market Share by Company, 2020-2025
2.2 Global Through Glass Via (TGV) Technology Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.3 Global Through Glass Via (TGV) Technology Concentration Ratio
2.4 Global Through Glass Via (TGV) Technology Mergers & Acquisitions, Expansion Plans
2.5 Global Through Glass Via (TGV) Technology Major Companies Product Type
2.6 Head Office and Area Served of Key Players

3 China Leading Players, Market Share and Ranking
3.1 By Revenue of Through Glass Via (TGV) Technology, China Market Share by Company, 2020-2025
3.2 China Through Glass Via (TGV) Technology Through Glass Via (TGV) Technology Participants, Market Position (Tier 1, Tier 2, and Tier 3)

4 Industry Chain Analysis
4.1 Through Glass Via (TGV) Technology Industry Chain
4.2 Through Glass Via (TGV) Technology Upstream Analysis
4.2.1 Through Glass Via (TGV) Technology Core Raw Materials
4.2.2 Main Manufacturers of Through Glass Via (TGV) Technology Core Raw Materials
4.3 Midstream Analysis
4.4 Downstream Analysis
4.5 Through Glass Via (TGV) Technology Production Mode
4.6 Through Glass Via (TGV) Technology Procurement Model
4.7 Through Glass Via (TGV) Technology Industry Sales Model and Sales Channels
4.7.1 Through Glass Via (TGV) Technology Sales Model
4.7.2 Through Glass Via (TGV) Technology Typical Distributors

5 Sights by Type
5.1 Through Glass Via (TGV) Technology Classification by Type
5.1.1 Panel-Level TGV Substrate
5.1.2 Wafer-Level TGV Substrate
5.2 by Type, Global Through Glass Via (TGV) Technology Consumption Value & CAGR, 2020 VS 2024 VS 2031
5.3 by Type, Global Through Glass Via (TGV) Technology Consumption Value, 2020-2031

6 Sights by Application
6.1 Through Glass Via (TGV) Technology Segment by Application
6.1.1 Consumer Electronics
6.1.2 Automotive Electronics
6.1.3 High-performance Computing and Data Centers
6.1.4 Others
6.2 by Application, Global Through Glass Via (TGV) Technology Consumption Value & CAGR, 2020 VS 2024 VS 2031
6.3 by Application, Global Through Glass Via (TGV) Technology Consumption Value, 2020-2031

7 Sales Sights by Region
7.1 By Region, Global Through Glass Via (TGV) Technology Consumption Value, 2020 VS 2024 VS 2031
7.2 By Region, Global Through Glass Via (TGV) Technology Consumption Value, 2020-2031
7.3 North America
7.3.1 North America Through Glass Via (TGV) Technology Market Size & Forecasts, 2020-2031
7.3.2 By Country, North America Through Glass Via (TGV) Technology Market Size Market Share
7.4 Europe
7.4.1 Europe Through Glass Via (TGV) Technology Market Size & Forecasts, 2020-2031
7.4.2 By Country, Europe Through Glass Via (TGV) Technology Market Size Market Share
7.5 Asia Pacific
7.5.1 Asia Pacific Through Glass Via (TGV) Technology Market Size & Forecasts, 2020-2031
7.5.2 By Country/Region, Asia Pacific Through Glass Via (TGV) Technology Market Size Market Share
7.6 South America
7.6.1 South AmericaThrough Glass Via (TGV) Technology Market Size & Forecasts, 2020-2031
7.6.2 By Country, South America Through Glass Via (TGV) Technology Market Size Market Share
7.7 Middle East & Africa

8 Sales Sights by Country Level
8.1 By Country, Global Through Glass Via (TGV) Technology Market Size & CAGR, 2020 VS 2024 VS 2031
8.2 By Country, Global Through Glass Via (TGV) Technology Consumption Value, 2020-2031
8.3 United States
8.3.1 United States Through Glass Via (TGV) Technology Market Size, 2020-2031
8.3.2 by Type, United States Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.3.3 by Application, United States Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.4 Europe
8.4.1 Europe Through Glass Via (TGV) Technology Market Size, 2020-2031
8.4.2 by Type, Europe Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.4.3 by Application, Europe Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.5 China
8.5.1 China Through Glass Via (TGV) Technology Market Size, 2020-2031
8.5.2 by Type, China Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.5.3 by Application, China Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.6 Japan
8.6.1 Japan Through Glass Via (TGV) Technology Market Size, 2020-2031
8.6.2 by Type, Japan Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.6.3 by Application, Japan Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.7 South Korea
8.7.1 South Korea Through Glass Via (TGV) Technology Market Size, 2020-2031
8.7.2 by Type, South Korea Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.7.3 by Application, South Korea Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.8 Southeast Asia
8.8.1 Southeast Asia Through Glass Via (TGV) Technology Market Size, 2020-2031
8.8.2 by Type, Southeast Asia Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.8.3 by Application, Southeast Asia Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.9 India
8.9.1 India Through Glass Via (TGV) Technology Market Size, 2020-2031
8.9.2 by Type, India Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.9.3 by Application, India Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.10 Middle East & Africa
8.10.1 Middle East & Africa Through Glass Via (TGV) Technology Market Size, 2020-2031
8.10.2 by Type, Middle East & Africa Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031
8.10.3 by Application, Middle East & Africa Through Glass Via (TGV) Technology Consumption Value Market Share, 2024 VS 2031

9 Company Profile
9.1 Corning
9.1.1 Corning Company Information, Head Office, Market Area, and Industry Position
9.1.2 Corning Company Profile and Main Business
9.1.3 Corning Through Glass Via (TGV) Technology Models, Specifications, and Application
9.1.4 Corning Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.1.5 Corning Recent Developments
9.2 LPKF
9.2.1 LPKF Company Information, Head Office, Market Area, and Industry Position
9.2.2 LPKF Company Profile and Main Business
9.2.3 LPKF Through Glass Via (TGV) Technology Models, Specifications, and Application
9.2.4 LPKF Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.2.5 LPKF Recent Developments
9.3 Samtec
9.3.1 Samtec Company Information, Head Office, Market Area, and Industry Position
9.3.2 Samtec Company Profile and Main Business
9.3.3 Samtec Through Glass Via (TGV) Technology Models, Specifications, and Application
9.3.4 Samtec Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.3.5 Samtec Recent Developments
9.4 SCHOTT
9.4.1 SCHOTT Company Information, Head Office, Market Area, and Industry Position
9.4.2 SCHOTT Company Profile and Main Business
9.4.3 SCHOTT Through Glass Via (TGV) Technology Models, Specifications, and Application
9.4.4 SCHOTT Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.4.5 SCHOTT Recent Developments
9.5 Xiamen Sky Semiconductor Technology
9.5.1 Xiamen Sky Semiconductor Technology Company Information, Head Office, Market Area, and Industry Position
9.5.2 Xiamen Sky Semiconductor Technology Company Profile and Main Business
9.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Models, Specifications, and Application
9.5.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.5.5 Xiamen Sky Semiconductor Technology Recent Developments
9.6 Tecnisco
9.6.1 Tecnisco Company Information, Head Office, Market Area, and Industry Position
9.6.2 Tecnisco Company Profile and Main Business
9.6.3 Tecnisco Through Glass Via (TGV) Technology Models, Specifications, and Application
9.6.4 Tecnisco Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.6.5 Tecnisco Recent Developments
9.7 PLANOPTIK
9.7.1 PLANOPTIK Company Information, Head Office, Market Area, and Industry Position
9.7.2 PLANOPTIK Company Profile and Main Business
9.7.3 PLANOPTIK Through Glass Via (TGV) Technology Models, Specifications, and Application
9.7.4 PLANOPTIK Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.7.5 PLANOPTIK Recent Developments
9.8 NSG Group
9.8.1 NSG Group Company Information, Head Office, Market Area, and Industry Position
9.8.2 NSG Group Company Profile and Main Business
9.8.3 NSG Group Through Glass Via (TGV) Technology Models, Specifications, and Application
9.8.4 NSG Group Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.8.5 NSG Group Recent Developments
9.9 AGC
9.9.1 AGC Company Information, Head Office, Market Area, and Industry Position
9.9.2 AGC Company Profile and Main Business
9.9.3 AGC Through Glass Via (TGV) Technology Models, Specifications, and Application
9.9.4 AGC Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.9.5 AGC Recent Developments
9.10 JNTC
9.10.1 JNTC Company Information, Head Office, Market Area, and Industry Position
9.10.2 JNTC Company Profile and Main Business
9.10.3 JNTC Through Glass Via (TGV) Technology Models, Specifications, and Application
9.10.4 JNTC Through Glass Via (TGV) Technology Revenue and Gross Margin, 2020-2025
9.10.5 JNTC Recent Developments

10 Conclusion

11 Appendix
11.1 Research Methodology
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Market Estimation Model
11.4 Disclaimer

According to YH Research, the global market for Through Glass Via (TGV) Technology should grow from US$ 131 million in 2024 to US$ 474 million by 2031, with a CAGR of 19.0% for the period of 2025-2031.

Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.

Through Glass Via (TGV) Technology

Unit: US$ M

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In-depth insight into market trends

The supply chain for TGV substrates typically involves upstream glass material suppliers, midstream laser drilling and copper filling processing plants, and downstream packaging houses and semiconductor manufacturers. Supplier concentration is relatively high, with significant technical barriers. Major suppliers are primarily located in the United States, Japan, South Korea, Europe, and a few regions in China.

TGV technology was initially developed by American, Japanese, and European companies to enable micro-interconnects for high-density packaging, addressing bottlenecks in high-speed and high-frequency signal transmission associated with silicon interconnects and traditional PCBs. In recent years, with the rapid development of 5G, optoelectronic devices, and sensors, TGV technology has gradually been applied in MEMS, optical modules, and high-frequency antenna packaging.

The primary industry prospects lie in high-frequency and high-speed packaging applications, such as 5G RF modules, optical communication devices, micro-sensors, and Micro-Electro-Mechanical Systems (MEMS) devices. The market for mid-to-low-end TGV products is relatively small, while high-end products maintain strong competitiveness due to their precision and reliability. In the future, with the growing demand for heterogeneous integration and advanced packaging, the TGV market is expected to continue expanding.

TGV substrate production involves processes such as glass cutting, laser drilling, cleaning, metallization, and electroplating. The production capacity of a single line is usually constrained by glass size, via diameter, and filling efficiency. A high-precision TGV production line can have an annual capacity ranging from several hundred thousand to millions of wafers, depending on the aperture, number of layers, and copper filling speed.

Due to complex processes and high technical barriers, TGV products generally yield high gross margins, typically within the range of 30% to 35%. The margin level is significantly influenced by the degree of production line automation, yield rate, and order scale.

Costs are primarily composed of raw materials (glass substrates account for approximately 50%-60%), processing technologies (laser drilling, copper deposition, electroplating, etc., accounting for 30%-40%), and equipment depreciation and labor (accounting for 10%-20%). High yield rates and high automation can significantly reduce unit costs.

After packaging is completed, TGV substrates are generally not sold separately but enter the market mainly as finished component devices. Production waste primarily consists of drilling debris, defective copper deposition products, and broken glass. Companies mitigate losses through recycling, reuse, or low-value disposal.

This report studies and analyses global Through Glass Via (TGV) Technology status and future trends, to help determine the Through Glass Via (TGV) Technology market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Through Glass Via (TGV) Technology, and provides market size (US$ million) and Year-over-Year growth, considering 2024 as the base year.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

To assess the competitive environment within the market including supplier revenue, market share, and company profiles.

Highlights
(1) Global Through Glass Via (TGV) Technology market size, history data 2020-2025, and forecast data 2026 -2031, (US$ million)
(2) Global Through Glass Via (TGV) Technology by company, revenue, market share and industry ranking 2020-2025, (US$ million)
(3) China Through Glass Via (TGV) Technology by company, revenue, market share and industry ranking 2020-2025, (US$ million)
(4) Global Through Glass Via (TGV) Technology key consuming regions, consumption value and demand structure
(5) Through Glass Via (TGV) Technology industry chains, upstream, midstream and downstream
Market segment by players, this report covers
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC

Market segment by Type, covers
Panel-Level TGV Substrate
Wafer-Level TGV Substrate

Market segment by Application, can be divided into
Consumer Electronics
Automotive Electronics
High-performance Computing and Data Centers
Others

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe Through Glass Via (TGV) Technology product scope, global consumption value, China consumption value, development opportunities, challenges, trends, and policies.
Chapter 2: Global Through Glass Via (TGV) Technology market share and ranking of major manufacturers, revenue, 2020-2025
Chapter 3: China Through Glass Via (TGV) Technology market share and ranking of major manufacturers, revenue, 2020-2025
Chapter 4: Through Glass Via (TGV) Technology industry chain, upstream, medium-stream, and downstream.
Chapter 5: Segment by Type, consumption value, percent & CAGR, 2020-2031
Chapter 6: Segment by Application, consumption value, percent & CAGR, 2020-2031
Chapter 7: Segment in regional level, consumption value, percent & CAGR, 2020-2031
Chapter 8: Segment in country level, consumption value, percent & CAGR, 2020-2031
Chapter 9: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, revenue, gross margin.
Chapter 10: Conclusions