Organic Package Substrates - Global Top Players Market Share and Ranking 2025- YH Research

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Organic Package Substrates - Global Top Players Market Share and Ranking 2025

Publication Date: 2025-11-30
Report Id: 2857602
Industry: Electronics & Semiconductor
Report Page: 135
Chart: 138

PDF Download

Publication Date: 2025-11-30
Report Id: 2857602
Industry: Electronics & Semiconductor
Report Page: 135
Chart: 138

PDF Download

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Table of Contents
Description
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1 Market Overview
1.1 Organic Package Substrates Definition
1.2 Global Organic Package Substrates Market Size and Forecast
1.2.1 By Consumption Value, Global Organic Package Substrates Market Size, 2020-2031
1.2.2 By Sales Quantity, Global Organic Package Substrates Market Size, 2020-2031
1.2.3 Global Organic Package Substrates Average Selling Price (ASP), 2020-2031
1.3 China Organic Package Substrates Market Size and Forecast
1.3.1 By Consumption Value, China Organic Package Substrates Market Size, 2020-2031
1.3.2 By Sales Quantity, China Organic Package Substrates Market Size, 2020-2031
1.3.3 China Organic Package Substrates Average Selling Price (ASP), 2020-2031
1.4 Share of China Organic Package Substrates Market with Respect to the Global Market
1.4.1 By Consumption Value, China Organic Package Substrates Market Share in Global, 2020-2031
1.4.2 By Sales Quantity, China Organic Package Substrates Market Share in Global, 2020-2031
1.4.3 Organic Package Substrates Market Size: China VS Global, 2020-2031
1.5 Organic Package Substrates Market Dynamics
1.5.1 Organic Package Substrates Market Drivers
1.5.2 Organic Package Substrates Market Restraints
1.5.3 Organic Package Substrates Industry Trends
1.5.4 Organic Package Substrates Industry Policy

2 Global Leading Manufacturers and Market Share
2.1 By Revenue of Organic Package Substrates, Global Market Share by Company, 2020-2025
2.2 By Sales Quantity of Organic Package Substrates, Global Market Share by Company, 2020-2025
2.3 Organic Package Substrates Average Selling Price (ASP) by Company, 2020-2025
2.4 Global Organic Package Substrates Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.5 Global Organic Package Substrates Concentration Ratio
2.6 Global Organic Package Substrates Mergers & Acquisitions, Expansion Plans
2.7 Global Organic Package Substrates Manufacturers Product Type
2.8 Head Office and Organic Package Substrates Production Site of Key Manufacturer
2.9 Organic Package Substrates Capacity of Major Manufacturers and Future Plan

3 China Leading Manufacturers and Market Share
3.1 By Revenue of Organic Package Substrates, China Market Share by Company, 2020-2025
3.2 By Sales Quantity of Organic Package Substrates, China Market Share by Company, 2020-2025
3.3 China Organic Package Substrates Organic Package Substrates Participants, Market Position (Tier 1, Tier 2, and Tier 3)

4 Global Producing Regions
4.1 Global Organic Package Substrates Capacity, Output and Capacity Utilization, 2020-2031
4.2 Global Organic Package Substrates Capacity by Region
4.3 Global Organic Package Substrates Production & Forecast by Region, 2020 VS 2024 VS 2031
4.4 Global Organic Package Substrates Production by Region, 2020-2031
4.5 Global Organic Package Substrates Production Market Share & Forecast by Region, 2020-2031

5 Industry Chain Analysis
5.1 Organic Package Substrates Industry Chain
5.2 Organic Package Substrates Upstream Analysis
5.2.1 Organic Package Substrates Core Raw Materials
5.2.2 Main Manufacturers of Organic Package Substrates Core Raw Materials
5.3 Midstream Analysis
5.4 Downstream Analysis
5.5 Organic Package Substrates Production Mode
5.6 Organic Package Substrates Procurement Model
5.7 Organic Package Substrates Industry Sales Model and Sales Channels
5.7.1 Organic Package Substrates Sales Model
5.7.2 Organic Package Substrates Typical Distributors

6 Sights by Type
6.1 Organic Package Substrates Classification by Type
6.1.1 FC-BGA
6.1.2 FC-CSP
6.1.3 WB BGA
6.1.4 WB CSP
6.1.5 RF Module
6.1.6 Others
6.2 by Type, Global Organic Package Substrates Consumption Value & CAGR, 2020 VS 2024 VS 2031
6.3 by Type, Global Organic Package Substrates Consumption Value, 2020-2031
6.4 by Type, Global Organic Package Substrates Sales Quantity, 2020-2031
6.5 by Type, Global Organic Package Substrates Average Selling Price (ASP), 2020-2031

7 Sights by Material Type
7.1 Organic Package Substrates Classification by Material Type
7.1.1 ABF Substrate
7.1.2 BT Substrate
7.2 by Material Type, Global Organic Package Substrates Consumption Value & CAGR, 2020 VS 2024 VS 2031
7.3 by Material Type, Global Organic Package Substrates Consumption Value, 2020-2031
7.4 by Material Type, Global Organic Package Substrates Sales Quantity, 2020-2031
7.5 by Material Type, Global Organic Package Substrates Average Selling Price (ASP), 2020-2031

8 Sights by Chips Type
8.1 Organic Package Substrates Classification by Chips Type
8.1.1 Non-memory IC Substrate
8.1.2 Memory Substrate
8.2 by Chips Type, Global Organic Package Substrates Consumption Value & CAGR, 2020 VS 2024 VS 2031
8.3 by Chips Type, Global Organic Package Substrates Consumption Value, 2020-2031
8.4 by Chips Type, Global Organic Package Substrates Sales Quantity, 2020-2031
8.5 by Chips Type, Global Organic Package Substrates Average Selling Price (ASP), 2020-2031

9 Sights by Application
9.1 Organic Package Substrates Segment by Application
9.1.1 PC (Tablet, Laptop)
9.1.2 Smart Phone
9.1.3 Communication
9.1.4 Data Center & Servers
9.1.5 Wearable Devices
9.1.6 Other
9.2 by Application, Global Organic Package Substrates Consumption Value & CAGR, 2020 VS 2024 VS 2031
9.3 by Application, Global Organic Package Substrates Consumption Value, 2020-2031
9.4 by Application, Global Organic Package Substrates Sales Quantity, 2020-2031
9.5 by Application, Global Organic Package Substrates Price, 2020-2031

10 Sales Sights by Region
10.1 By Region, Global Organic Package Substrates Consumption Value, 2020 VS 2024 VS 2031
10.2 By Region, Global Organic Package Substrates Consumption Value, 2020-2031
10.3 By Region, Global Organic Package Substrates Sales Quantity, 2020-2031
10.4 North America
10.4.1 North America Organic Package Substrates Market Size & Forecasts, 2020-2031
10.4.2 By Country, North America Organic Package Substrates Market Size Market Share
10.5 Europe
10.5.1 Europe Organic Package Substrates Market Size & Forecasts, 2020-2031
10.5.2 By Country, Europe Organic Package Substrates Market Size Market Share
10.6 Asia Pacific
10.6.1 Asia Pacific Organic Package Substrates Market Size & Forecasts, 2020-2031
10.6.2 By Country/Region, Asia Pacific Organic Package Substrates Market Size Market Share
10.7 South America
10.7.1 South America Organic Package Substrates Market Size & Forecasts, 2020-2031
10.7.2 By Country, South America Organic Package Substrates Market Size Market Share
10.8 Middle East & Africa

11 Sales Sights by Country Level
11.1 By Country, Global Organic Package Substrates Market Size & CAGR, 2020 VS 2024 VS 2031
11.2 By Country, Global Organic Package Substrates Consumption Value, 2020-2031
11.3 By Country, Global Organic Package Substrates Sales Quantity, 2020-2031
11.4 United States
11.4.1 United States Organic Package Substrates Market Size, 2020-2031
11.4.2 by Type, United States Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.4.3 by Application, United States Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.5 Europe
11.5.1 Europe Organic Package Substrates Market Size, 2020-2031
11.5.2 by Type, Europe Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.5.3 by Application, Europe Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.6 China
11.6.1 China Organic Package Substrates Market Size, 2020-2031
11.6.2 by Type, China Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.6.3 by Application, China Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.7 Japan
11.7.1 Japan Organic Package Substrates Market Size, 2020-2031
11.7.2 by Type, Japan Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.7.3 by Application, Japan Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.8 South Korea
11.8.1 South Korea Organic Package Substrates Market Size, 2020-2031
11.8.2 by Type, South Korea Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.8.3 by Application, South Korea Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.9 Southeast Asia
11.9.1 Southeast Asia Organic Package Substrates Market Size, 2020-2031
11.9.2 by Type, Southeast Asia Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.9.3 by Application, Southeast Asia Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.10 India
11.10.1 India Organic Package Substrates Market Size, 2020-2031
11.10.2 by Type, India Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.10.3 by Application, India Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.11 Middle East & Africa
11.11.1 Middle East & Africa Organic Package Substrates Market Size, 2020-2031
11.11.2 by Type, Middle East & Africa Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031
11.11.3 by Application, Middle East & Africa Organic Package Substrates Sales Quantity Market Share, 2024 VS 2031

12 Manufacturers Profile
12.1 Unimicron
12.1.1 Unimicron Company Information, Head Office, Market Area, and Industry Position
12.1.2 Unimicron Organic Package Substrates Models, Specifications, and Application
12.1.3 Unimicron Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.1.4 Unimicron Company Profile and Main Business
12.1.5 Unimicron Recent Developments
12.2 Ibiden
12.2.1 Ibiden Company Information, Head Office, Market Area, and Industry Position
12.2.2 Ibiden Organic Package Substrates Models, Specifications, and Application
12.2.3 Ibiden Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.2.4 Ibiden Company Profile and Main Business
12.2.5 Ibiden Recent Developments
12.3 Nan Ya PCB
12.3.1 Nan Ya PCB Company Information, Head Office, Market Area, and Industry Position
12.3.2 Nan Ya PCB Organic Package Substrates Models, Specifications, and Application
12.3.3 Nan Ya PCB Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.3.4 Nan Ya PCB Company Profile and Main Business
12.3.5 Nan Ya PCB Recent Developments
12.4 Shinko Electric Industries
12.4.1 Shinko Electric Industries Company Information, Head Office, Market Area, and Industry Position
12.4.2 Shinko Electric Industries Organic Package Substrates Models, Specifications, and Application
12.4.3 Shinko Electric Industries Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.4.4 Shinko Electric Industries Company Profile and Main Business
12.4.5 Shinko Electric Industries Recent Developments
12.5 Kinsus Interconnect Technology
12.5.1 Kinsus Interconnect Technology Company Information, Head Office, Market Area, and Industry Position
12.5.2 Kinsus Interconnect Technology Organic Package Substrates Models, Specifications, and Application
12.5.3 Kinsus Interconnect Technology Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.5.4 Kinsus Interconnect Technology Company Profile and Main Business
12.5.5 Kinsus Interconnect Technology Recent Developments
12.6 AT&S
12.6.1 AT&S Company Information, Head Office, Market Area, and Industry Position
12.6.2 AT&S Organic Package Substrates Models, Specifications, and Application
12.6.3 AT&S Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.6.4 AT&S Company Profile and Main Business
12.6.5 AT&S Recent Developments
12.7 Samsung Electro-Mechanics
12.7.1 Samsung Electro-Mechanics Company Information, Head Office, Market Area, and Industry Position
12.7.2 Samsung Electro-Mechanics Organic Package Substrates Models, Specifications, and Application
12.7.3 Samsung Electro-Mechanics Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.7.4 Samsung Electro-Mechanics Company Profile and Main Business
12.7.5 Samsung Electro-Mechanics Recent Developments
12.8 Kyocera
12.8.1 Kyocera Company Information, Head Office, Market Area, and Industry Position
12.8.2 Kyocera Organic Package Substrates Models, Specifications, and Application
12.8.3 Kyocera Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.8.4 Kyocera Company Profile and Main Business
12.8.5 Kyocera Recent Developments
12.9 Toppan
12.9.1 Toppan Company Information, Head Office, Market Area, and Industry Position
12.9.2 Toppan Organic Package Substrates Models, Specifications, and Application
12.9.3 Toppan Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.9.4 Toppan Company Profile and Main Business
12.9.5 Toppan Recent Developments
12.10 Zhen Ding Technology
12.10.1 Zhen Ding Technology Company Information, Head Office, Market Area, and Industry Position
12.10.2 Zhen Ding Technology Organic Package Substrates Models, Specifications, and Application
12.10.3 Zhen Ding Technology Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.10.4 Zhen Ding Technology Company Profile and Main Business
12.10.5 Zhen Ding Technology Recent Developments
12.11 Daeduck Electronics
12.11.1 Daeduck Electronics Company Information, Head Office, Market Area, and Industry Position
12.11.2 Daeduck Electronics Organic Package Substrates Models, Specifications, and Application
12.11.3 Daeduck Electronics Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.11.4 Daeduck Electronics Company Profile and Main Business
12.11.5 Daeduck Electronics Recent Developments
12.12 Zhuhai Access Semiconductor
12.12.1 Zhuhai Access Semiconductor Company Information, Head Office, Market Area, and Industry Position
12.12.2 Zhuhai Access Semiconductor Organic Package Substrates Models, Specifications, and Application
12.12.3 Zhuhai Access Semiconductor Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.12.4 Zhuhai Access Semiconductor Company Profile and Main Business
12.12.5 Zhuhai Access Semiconductor Recent Developments
12.13 LG InnoTek
12.13.1 LG InnoTek Company Information, Head Office, Market Area, and Industry Position
12.13.2 LG InnoTek Organic Package Substrates Models, Specifications, and Application
12.13.3 LG InnoTek Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.13.4 LG InnoTek Company Profile and Main Business
12.13.5 LG InnoTek Recent Developments
12.14 Shennan Circuit
12.14.1 Shennan Circuit Company Information, Head Office, Market Area, and Industry Position
12.14.2 Shennan Circuit Organic Package Substrates Models, Specifications, and Application
12.14.3 Shennan Circuit Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.14.4 Shennan Circuit Company Profile and Main Business
12.14.5 Shennan Circuit Recent Developments
12.15 Shenzhen Fastprint Circuit Tech
12.15.1 Shenzhen Fastprint Circuit Tech Company Information, Head Office, Market Area, and Industry Position
12.15.2 Shenzhen Fastprint Circuit Tech Organic Package Substrates Models, Specifications, and Application
12.15.3 Shenzhen Fastprint Circuit Tech Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.15.4 Shenzhen Fastprint Circuit Tech Company Profile and Main Business
12.15.5 Shenzhen Fastprint Circuit Tech Recent Developments
12.16 Korea Circuit
12.16.1 Korea Circuit Company Information, Head Office, Market Area, and Industry Position
12.16.2 Korea Circuit Organic Package Substrates Models, Specifications, and Application
12.16.3 Korea Circuit Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.16.4 Korea Circuit Company Profile and Main Business
12.16.5 Korea Circuit Recent Developments
12.17 FICT LIMITED
12.17.1 FICT LIMITED Company Information, Head Office, Market Area, and Industry Position
12.17.2 FICT LIMITED Organic Package Substrates Models, Specifications, and Application
12.17.3 FICT LIMITED Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.17.4 FICT LIMITED Company Profile and Main Business
12.17.5 FICT LIMITED Recent Developments
12.18 AKM Meadville
12.18.1 AKM Meadville Company Information, Head Office, Market Area, and Industry Position
12.18.2 AKM Meadville Organic Package Substrates Models, Specifications, and Application
12.18.3 AKM Meadville Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.18.4 AKM Meadville Company Profile and Main Business
12.18.5 AKM Meadville Recent Developments
12.19 Shenzhen Hemei Jingyi Semiconductor Technology
12.19.1 Shenzhen Hemei Jingyi Semiconductor Technology Company Information, Head Office, Market Area, and Industry Position
12.19.2 Shenzhen Hemei Jingyi Semiconductor Technology Organic Package Substrates Models, Specifications, and Application
12.19.3 Shenzhen Hemei Jingyi Semiconductor Technology Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.19.4 Shenzhen Hemei Jingyi Semiconductor Technology Company Profile and Main Business
12.19.5 Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments
12.20 Simmtech
12.20.1 Simmtech Company Information, Head Office, Market Area, and Industry Position
12.20.2 Simmtech Organic Package Substrates Models, Specifications, and Application
12.20.3 Simmtech Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.20.4 Simmtech Company Profile and Main Business
12.20.5 Simmtech Recent Developments
12.21 HOREXS
12.21.1 HOREXS Company Information, Head Office, Market Area, and Industry Position
12.21.2 HOREXS Organic Package Substrates Models, Specifications, and Application
12.21.3 HOREXS Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.21.4 HOREXS Company Profile and Main Business
12.21.5 HOREXS Recent Developments
12.22 ASE Material
12.22.1 ASE Material Company Information, Head Office, Market Area, and Industry Position
12.22.2 ASE Material Organic Package Substrates Models, Specifications, and Application
12.22.3 ASE Material Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.22.4 ASE Material Company Profile and Main Business
12.22.5 ASE Material Recent Developments
12.23 AaltoSemi
12.23.1 AaltoSemi Company Information, Head Office, Market Area, and Industry Position
12.23.2 AaltoSemi Organic Package Substrates Models, Specifications, and Application
12.23.3 AaltoSemi Organic Package Substrates Sales Quantity, Revenue, Price and Gross Margin, 2020-2025
12.23.4 AaltoSemi Company Profile and Main Business
12.23.5 AaltoSemi Recent Developments

13 Conclusion

14 Appendix
14.1 Research Methodology
14.2 Data Source
14.2.1 Secondary Sources
14.2.2 Primary Sources
14.3 Market Estimation Model
14.4 Disclaimer

According to YH Research, the global market for Organic Package Substrates should grow from US$ 13623 million in 2024 to US$ 21651 million by 2031, with a CAGR of 7.5% for the period of 2025-2031.

The strategic recalibration of 2025 U.S. tariff mechanisms is redefining global economic governance norms. This study deciphers the transmission mechanisms of tariff escalation pathways and global policy responses on corporate investment strategies, regional trade networks, and critical material supply architectures.

Organic Package Substrates

According to YH Research, the global market for Organic Package Substrates should grow from US$ 13623 million in 2024 to US$ 21651 million by 2031, with a CAGR of 7.5% for the period of 2025-2031.

Unit: US$ M

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In-depth insight into market trends

IC packaging substrates, also known as IC substrates, package substrates or IC carrier boards, are high-density organic baseboards that sit between bare semiconductor dies and the system PCB, forming a miniaturized “bridge” that fans out the die’s fine-pitch I/Os to the coarser pitch of the motherboard while providing mechanical support, thermal paths and electrical performance optimization.

Structurally, mainstream products include several families: Flip-Chip BGA (FCBGA) substrates, typically using ABF or high-performance BT laminates with 8–16 or more build-up layers, targeted at high-end CPUs, GPUs, FPGAs, ASICs and AI accelerators used in servers and networking equipment; FC-CSP/WLCSP/WBCSP chip-scale substrates, smaller and with fewer layers, widely adopted for mobile application processors, basebands, PMICs, RF transceivers and memory devices in smartphones and consumer products; wire-bond BGA (WB-BGA) substrates for cost-sensitive mid-performance devices such as MCUs, automotive logic and power management ICs; and SiP (System-in-Package) and RF-module substrates, which integrate multiple bare dies (logic/RF/memory/power) plus passives on the same organic substrate, sometimes including antennas to form AiP/AoP RF front-end modules for 5G phones, wearables, mmWave small cells and automotive radar. From a materials/platform view, IC substrates can be categorized into ABF-based, BT-based, hybrid organic/inorganic and emerging glass-core substrates, each with distinct trade-offs in routing density, dielectric performance, CTE, warpage control and cost: ABF FCBGA serves HPC/AI/server and high-end GPU markets, BT FCBGA/FC-CSP is dominant in smartphones and consumer electronics, WLCSP/WBCSP enables ultra-miniaturized SoCs and analog devices, while SiP/RF module substrates underpin highly integrated RF front-ends and multi-chip modules across mobile and IoT.

The main growth drivers can be summarized as: (i) the explosive rise of AI and high-performance computing, where we forecasts AI servers alone to consume about 20% of global ABF substrate demand by 2025 as GPUs/accelerators adopt larger substrates with more layers and I/Os; (ii) deployment of 5G and high-speed networking, which pushes switch ASICs, network processors and optical-module controllers toward higher data rates and tighter SI/PI specifications, driving demand for high-layer ABF substrates and RF SiP/RF-module substrates; (iii) growth in automotive electronics and electrification, where ADAS/AV SoCs, domain controllers and powertrain control ICs increasingly adopt BGA/FCBGA/SiP packages and thus require robust substrates with long-term reliability; and (iv) continued miniaturization and functional integration in smartphones, wearables and AR/VR, which drives adoption of WLCSP/WBCSP, PoP and SiP modules. Looking ahead, key trends include continued escalation in wiring density and package size (AI GPUs/CPUs with HBM stacks require larger organic substrates with line/space approaching 8/8 μm and toward 2/2 μm in some roadmaps), materials evolution and the rise of glass substrates (glass cores, with CTE on the order of a few ppm/°C and excellent dimensional stability, are being explored by Intel, Samsung and leading substrate makers as a potential answer to ABF warpage and scaling bottlenecks), and persistent bottlenecks in ABF films and high-end glass fabrics: Ajinomoto’s ABF is widely described as a quasi-monopoly in build-up films for advanced substrates, making it a critical failure point in the high-end packaging supply chain, while 2025 roughly 20% price hikes in BT substrates and high-end fiberglass fabrics for IC substrates amid surging AI demand and tight supply. Overall, IC substrates will remain a central “enabling infrastructure” for chip performance over the next 5–10 years, with their technology roadmap tightly coupled to advances in process nodes, HBM stacking and system-level packaging.

The IC packaging substrate industry exhibits a highly concentrated, oligopolistic structure with capacity heavily clustered in Asia. the top five IC substrate vendors—commonly listing Unimicron, Samsung Electro-Mechanics, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, LG InnoTek, Simmtech, Daeduck Electronics, AT&S, Shennan Circuit, etc. etc.—collectively hold around 80% of global market share. In ABF substrates specifically, Unimicron, Ibiden, Nan Ya PCB, Shinko, Kinsus, SEMCO and AT&S account for roughly 90% of global revenue, while BT and other organic substrates for RF and general-purpose applications are led by SEMCO, LG Innotek, Simmtech, Daeduck and other Korean and Japanese/European players. In Greater China, beyond China Taiwan’s Unimicron, Nan Ya PCB and Kinsus, mainland Chinese firms such as Shennan Circuits, Shenzhen Fastprint Circuit Tech, Zhuhai Access Semiconductor, Shenzhen Hemei Jingyi Semiconductor Technology, HOREXS and others have secured positions in AP/baseband, RF, partial automotive and networking-chip substrates, particularly in BT and mid-range ABF. At the high end, however, FCBGA/ABF substrates remain a stronghold for Japanese and Taiwanese vendors due to demanding requirements on fine line/space, multi-layer build-up, warpage control, CAF mitigation and long-term reliability. Mordor Intelligence points out that Ibiden, Shinko, ASE Technology, Unimicron and SEMCO form the core of high-end substrate supply and maintain long-term contracts with CPU and GPU leaders, while Ajinomoto’s near-monopoly in ABF resin and the dependence on Nittobo, Taiwan Glass and others for low-CTE/low-Dk glass fabrics further reinforce supply-side concentration. In response, major customers and alternative material suppliers have funded “anti-Ajinomoto” efforts, including competing build-up resins and glass-core substrates, to dilute single-vendor risk and diversify the high-end substrate ecosystem.

This report studies and analyses global Organic Package Substrates status and future trends, helps the client to determine the Organic Package Substrates market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Organic Package Substrates, and provides market size (in K square meters & US$ million) and Year-over-Year growth, considering 2024 as the base year.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

To assess the competitive environment within the market including supplier revenue, market share, and company profiles.

Highlights
(1) Global Organic Package Substrates market size, history data 2020-2025, and forecast data 2026-2031, (US$ million) & (K square meters)
(2) Global Organic Package Substrates sales, revenue, price by company, market share and industry ranking 2020-2025, (US$ million) & (K square meters)
(3) China Organic Package Substrates sales, revenue, price by company, market share and industry ranking 2020-2025, (US$ million) & (K square meters)
(4) Global Organic Package Substrates key consuming regions, consumption quantity, consumption value and demand structure
(5) Global Organic Package Substrates key producing regions, capacity, production, and year over year growth
(6) Organic Package Substrates industry chains, upstream, midstream and downstream
Market segment by players, this report covers
    Unimicron
    Ibiden
    Nan Ya PCB
    Shinko Electric Industries
    Kinsus Interconnect Technology
    AT&S
    Samsung Electro-Mechanics
    Kyocera
    Toppan
    Zhen Ding Technology
    Daeduck Electronics
    Zhuhai Access Semiconductor
    LG InnoTek
    Shennan Circuit
    Shenzhen Fastprint Circuit Tech
    Korea Circuit
    FICT LIMITED
    AKM Meadville
    Shenzhen Hemei Jingyi Semiconductor Technology
    Simmtech
    HOREXS
    ASE Material
    AaltoSemi

Market segment by Type, covers
    FC-BGA
    FC-CSP
    WB BGA
    WB CSP
    RF Module
    Others

Market segment by Material Type, covers
    ABF Substrate
    BT Substrate

Market segment by Chips Type, covers
    Non-memory IC Substrate
    Memory Substrate

Market segment by Application, can be divided into
    PC (Tablet, Laptop)
    Smart Phone
    Communication
    Data Center & Servers
    Wearable Devices
    Other

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe Organic Package Substrates product scope, global sales quantity, value and average price, China sales quantity, value and average price, development opportunities, challenges, trends, and policies.
Chapter 2: Global Organic Package Substrates market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2025
Chapter 3: China Organic Package Substrates market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2025
Chapter 4: Global key producing regions of Organic Package Substrates, percent & CAGR, 2020-2031
Chapter 5: Organic Package Substrates industry chain, upstream, medium-stream, and downstream.
Chapter 6: Segment by Type, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 7: Segment by Application, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 8: Segment in regional level, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 9: Segment in country level, sales quantity, average price, consumption value, percent & CAGR, 2020-2031
Chapter 10: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, sales quantity, average price, revenue, gross margin.